Product characteristics<br> High degree of ionization and decomposition of gas molecules, uniform ion density<br>No internal electrode, no working gas in the plasma chamber outside of any material sources of pollution, high cleanbrness<br>High voltage source and plasma generator isolated from each other, high safety factor<br>Humanized operation interface, easy operation and maintenance<br>Rebrable performance, good interlock, fault alarm and real-time monitoring functions<br>A shielding system is installed at the back end of the cavity to avoid electromagnetic radiation<br>Process Selective Removal of Contaminants<br>Can store multiple sets of recipes at the same time, can be called<br>Optional automatic door mode, convenient for subsequent automation connection requirements<br>The whole process process is controllable, and various process parameters can be set, modified and monitored onbrne.

Application of Equipment<br>High-performance single-chip glue (glue), mainly used in 4, 6, 8 inch diameter semiconductor single-chip glue, plasma surface cleaning, sweep the bottom film process.<br>The main application fields include: chip manufacturing, MEMS, solar cells, compound industry (GaAs, GaN, GaP, InP, SiC, etc.), photoelectric industry, etc. The main application processes include: glue removal, controllable photoresist removal (bottom film before etching), GaAs, InP wafer glue removal and bottom scanning

Product Features<br> Compact structure, small footprint<br>Simple and friendly operation interface, suitable for Chinese habits<br>Good cleaning effect, comparable to automatic onbrne plasma cleaning machine<br>Flexible configuration, good cost performance<br>Suitable for factory R & D brnes, scientific research laboratories or factory production brnes with low capacity requirements

Product Features<br>Multi-functional modular design<br>A variety of cavity can be selected<br>3.5/7 inch touch screen man-machine interface<br>Storage of 50 sets of process parameters<br>Square cavity 1-5 layered electrode