The company's core team has been engaged in plasma cleaning and surface treatment research for more than ten years. The products have been widely used in integrated circuit IC packaging, LED packaging, LCD chip, component packaging, thick film circuit packaging, engineering plastic surface treatment and other processes. The in-line plasma cleaning machine produced by our company has significantly improved product reliability and yield compared with the traditional method.
Plasma technology can provide solutions for all types of pollutants, all substrates, and all subsequent treatments. In addition, it can also decompose residual pollutants composed of molecules.
The surface of the material after plasma treatment has good wettability, which is a prerequisite for ensuring good adhesion with the bonding body during painting, bonding, printing, or bonding.
Plasma technology can be used for both anisotropic and isotropic etching. Isotropic etching is performed through chemical etching, and anisotropic etching is performed through physical etching.
Using low-pressure plasma can improve workpieces with different coatings. For this purpose, gaseous and liquid raw materials are transported to a vacuum chamber, and the raw materials in the plasma, most of the short chain monomers, combine with each other to form long chain polymers, which are then coated on the surface of the substrate to form a uniform and reliable coating.
COMMON CLEANING STATIONS
Before wiring integrated circuit IC packaging
Before surface coating of optical components
Before PCB board copper deposition and component installation
Cleaning of the carrier before chip bonding
Before printing on the surface of rubber materials
Before wiring and packaging the shell
Before printing on the glass surface
Before IGBT wire bonding
Before wiring and bonding LED packaging
Before coating the surface of engineering plastics
Surface treatment of biological and medical devices
COMMON CLEANING PROCESS POSITION IN PACKAGE & TESTING FIELD
Remove surface pollutants
Increase surface hydrophilicity
Enhance the adhesion force on the substrate surface
Increase the pushing and pulling force
Reduce the defect rate of virtual soldering