APPLICATION AREA


精品画册高档样本

发布时间:2021-09-26 18:37

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精品画册高档样本

  画册是一个展示平台,画册设计可以用流畅的线条、有个人及企业的风貌、理念、和谐的图片或优美文字,富有创意,有可赏性,组合成一本具有宣传产品、品牌形象的精美画册。

  画册是图文并茂的一种理想表达,相对于单一的文字或是图册,画册都有着无与伦比的绝对优势。因为画册够醒目,能让人一目了然,但也够明了,因为其有相对的精简文字说明。

  画册设计可以用流畅的线条、和谐的图片,或优美文字,组合成一本富有创意,又具有可读、可赏性的精美画册。全方位立体展示企业或个人的风貌、理念,宣传产品、品牌形象。

  在画册制作、设计的过程中,我们会依据不同内容、不同的主题特征,进行优势整合,统筹规划,使画册在整体和谐中求创新。 一本好的画册、一定要有准确的市场定位,高水准的创意设计,从各角度展示画册载体的风采,画册可以大气磅礴、可以翔实细腻、可以缤纷多彩,可以朴实无华。优秀的设计人员为将企业画册创作成为一种艺术享受和营销动力。

  企业画册策划制作过程、实质上是一个企业理念的提炼、和实质的展现的过程。而非简单的图片文字的叠加。一本优秀的企业画册,应该是给人以艺术的感染、实力的展现、精神的呈现,而不是枯燥的文字和呆板的图片。

 

画册,展示平台,画册设计

Application Area


The company's core team has been engaged in plasma cleaning and surface treatment research for more than ten years. The products have been widely used in integrated circuit IC packaging, LED packaging, LCD chip, component packaging, thick film circuit packaging, engineering plastic surface treatment and other processes. The in-line plasma cleaning machine produced by our company has significantly improved product reliability and yield compared with the traditional method. 

01

MATERIAL CLEANING

Plasma technology can provide solutions for all types of pollutants, all substrates, and all subsequent treatments. In addition, it can also decompose residual pollutants composed of molecules.

02

MATERIAL ACTIVATION

The surface of the material after plasma treatment has good wettability, which is a prerequisite for ensuring good adhesion with the bonding body during painting, bonding, printing, or bonding.

03

MATERIAL ETCHING

Plasma technology can be used for both anisotropic and isotropic etching. Isotropic etching is performed through chemical etching, and anisotropic etching is performed through physical etching.

04

MATERIAL COATING

Using low-pressure plasma can improve workpieces with different coatings. For this purpose, gaseous and liquid raw materials are transported to a vacuum chamber, and the raw materials in the plasma, most of the short chain monomers, combine with each other to form long chain polymers, which are then coated on the surface of the substrate to form a uniform and reliable coating.

COMMON CLEANING STATIONS

Before wiring integrated circuit IC packaging

Before surface coating of optical components

Before PCB board copper deposition and component installation

Cleaning of the carrier before chip bonding

Before printing on the surface of rubber materials

Plasma debonding

Before wiring and packaging the shell

Before printing on the glass surface

Before IGBT wire bonding

Before wiring and bonding LED packaging

Before coating the surface of engineering plastics

Surface treatment of biological and medical devices

COMMON CLEANING PROCESS POSITION IN PACKAGE & TESTING FIELD

EFFICACY

01

Remove surface pollutants

02

Increase surface hydrophilicity

03

Enhance the adhesion force on the substrate surface

04

Increase the pushing and pulling force

05

Reduce the defect rate of virtual soldering

06

Reduce layering