There are still left until the opening. 27  Heaven

The 14th Semiconductor Equipment, Materials, and Core Components Exhibition (CSEAC 2026) will be held from August 31 to September 2, 2026, at the Wuxi Taihu International Expo Center. Spanning 70,000 square meters, the event will feature eight interconnected halls and bring together over 1,300 exhibitors, covering areas such as wafer fabrication, packaging and testing, core components, and materials. CSEAC will showcase leading domestic and international companies, offer a rich array of concurrent events, provide a comprehensive overview of industry trends, help you stay ahead of current market dynamics, and better prepare for future challenges and opportunities.

We cordially invite industry peers to attend this grand event and join us in witnessing this annual Chinese semiconductor extravaganza!

△ Please scan the QR code above to access the registration page △

Click to pre-register for a chance to win exciting prizes!

The audience is in August 25 Register for the exhibition in advance to enjoy free admission to the exhibition and open forums, plus an exclusive chance to enter a special raffle:

First Prize: HUAWEI Mate X7

Second Prize: Magnetic-Suction Fast-Charging Power Bank

Third Prize: Exquisite Handheld Electric Fan

*The raffle will be conducted in full public view, with winning results announced on-site at the exhibition. Winners must be present to verify their identity and claim their prizes.

CSEAC 2026

Exhibitor Highlights

Wuxi Awing Technology Co., Ltd.

Wuxi Awing Technology Co., Ltd.

Booth: A3-150

Company Profile : Founded in 2017, Wuxi Awing Technology Co., Ltd. focuses on the R&D and commercialization of plasma cleaning equipment and processes, concentrating on the niche market of surface treatment for precision manufacturing.

With over two decades of industry‑leading technological expertise, the team has independently developed a range of RF and microwave plasma cleaning systems capable of meeting diverse process requirements, including organic removal, metal oxidation–reduction, and surface activation. These systems are well suited to a variety of manufacturing applications, such as IC packaging, IGBT power devices, optical modules, LEDs, medical devices, and specialized engineering materials.

The company has obtained ISO 9001 certification and is accredited as a National High-Tech Enterprise, a provincial- and municipal-level Specialized, Refined, Distinctive, and Innovative Enterprise, a Gazelle Enterprise, and a Jiangsu Provincial Private Science and Technology Enterprise, among other prestigious designations.

The precision cleaning industry is currently expanding its growth potential. Aowei Ying Technology will continue to deepen its commitment to process innovation, leveraging its technological and service strengths to provide end-to-end solutions for production challenges such as micro‑contamination, poor adhesion, and oxidation‑related failures, thereby helping customers improve product yield and achieve long-term mutual success.

Main product name: In-line microwave plasma cleaning and reduction equipment

Product application areas: Integrated circuit packaging

Technical Indicators:

• Array-type microwave source: 2.45 GHz, maximum power 2000 W or 3000 W (optional)
• PLC-plus industrial PC control, with a multi‑recipe management mode.
• Contact angle < 30°; the key function is to remove the heavily oxidized layer, thereby achieving a reduction effect.
• Equipped with both barcode reading and scanning capabilities.

Process application: Copper lead frames are highly susceptible to oxidation, and the oxide layer can directly lead to bond‑pad failure, interfacial delamination, and reduced product reliability. This equipment employs a mature argon–hydrogen mixed‑gas plasma process to reduce and remove surface Cu₂O and CuO oxide layers on copper frames, restoring pad solderability and stripping away organic contaminants such as release agents, oils, and fine particulates. It is widely used for the pre‑treatment of copper lead frames in power devices, optical modules (TOSA/ROSA), and IC packaging.

Click here to view more product details.

*The CSEAC Organizing Committee reserves the right of final interpretation of the registration event.

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