Plasma technology can provide solutions for all types of pollutants, all substrates, and all subsequent treatments. In addition, it can also decompose residual pollutants composed of molecules.

The surface of the material after plasma treatment has good wettability, which is a prerequisite for ensuring good adhesion with the bonding body during painting, bonding, printing, or bonding.

Plasma technology can be used for both anisotropic and isotropic etching. Isotropic etching is performed through chemical etching, and anisotropic etching is performed through physical etching.

Using low-pressure plasma can improve workpieces with different coatings. For this purpose, gaseous and liquid raw materials are transported to a vacuum chamber, and the raw materials in the plasma, most of the short chain monomers, combine with each other to form long chain polymers, which are then coated on the surface of the substrate to form a uniform and reliable coating.