台历制作台历印刷台历设计

发布时间：2021-09-26 18:33

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　　中国始有历法大约在四千多年以前。根据甲骨文中的一页甲骨历，证明殷代的历法已具有相当的水平，这一页甲骨历是全人类最古老的历书实物，这页甲骨历也就叫日历。

　　唐诗：“山中无历日，寒尽不知年。”“历日”可能是最早的台历。唐时，史官按日裁纸，装订成册，每月一本。每页上写有月份和日期，留有空白，供近侍太监记载皇帝的言行，这就是“历日”。

　　“历日”月终先交皇帝审阅，然后由史官存档，供编《国史》用。因它有记时论事功能，文武百官竞相仿效。

早期发展

　　据史料记载，大约在1100年前唐顺宗永贞元年，皇宫中已经在使用日历了。当时的日历又称皇历，不仅记录着日期，而且是编修国史的重要资料。那时候的日历与对于点儿相似，把一年分为12册，按每月的天数来确定每册的页数，并将月份和日期写在每一页上，然后交给服侍皇帝的太监暂时保管，待太监在每日的空页上记下皇帝的言行并在每月月终交皇帝过目批准后，送史官存档，史官再将日历的内容与朝廷，国内各地区的大事结合起来，经提炼、润色后记录下来，便成为国史。

　　以后，由于日历给生活带来许多方便，就逐渐地进入了不少在朝大官的家庭，经过一番变动，编制成自家的日历；再往后，随着日历向大众化，家庭化的发展，人们也就把历书上的干支月令；节气及黄道吉日都印在日历上，并留下供记事用的的大片空白。

　　至于月历以后又发展成挂历、台历等各种形式，只是近一个世纪的事。台历款式从最初的简单样式，到许多变种样式，是最近几年来市场经济以及互联网的普及和发展都带动了不同文化之间的交流，当然台历也在其中，最普遍的就是台历已经趋向于更小更精致。

风貌,理念,历法,存档

Application Area

The company's core team has been engaged in plasma cleaning and surface treatment research for more than ten years. The products have been widely used in integrated circuit IC packaging, LED packaging, LCD chip, component packaging, thick film circuit packaging, engineering plastic surface treatment and other processes. The in-line plasma cleaning machine produced by our company has significantly improved product reliability and yield compared with the traditional method.

MATERIAL CLEANING

Plasma technology can provide solutions for all types of pollutants, all substrates, and all subsequent treatments. In addition, it can also decompose residual pollutants composed of molecules.

MATERIAL ACTIVATION

The surface of the material after plasma treatment has good wettability, which is a prerequisite for ensuring good adhesion with the bonding body during painting, bonding, printing, or bonding.

MATERIAL ETCHING

Plasma technology can be used for both anisotropic and isotropic etching. Isotropic etching is performed through chemical etching, and anisotropic etching is performed through physical etching.

MATERIAL COATING

Using low-pressure plasma can improve workpieces with different coatings. For this purpose, gaseous and liquid raw materials are transported to a vacuum chamber, and the raw materials in the plasma, most of the short chain monomers, combine with each other to form long chain polymers, which are then coated on the surface of the substrate to form a uniform and reliable coating.

COMMON CLEANING STATIONS

Before wiring integrated circuit IC packaging

Before surface coating of optical components

Before PCB board copper deposition and component installation

Cleaning of the carrier before chip bonding

Before printing on the surface of rubber materials

Plasma debonding

Before wiring and packaging the shell

Before printing on the glass surface

Before IGBT wire bonding

Before wiring and bonding LED packaging

Before coating the surface of engineering plastics