APPLICATION AREA


高档吊牌

发布时间:2021-09-26 18:34

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高档吊牌

  服装吊牌的设计、印刷、制作必须十分讲究,特别是平面设计,要把它当作一张小小的平面广告来对待,要细致考虑如下要素:必要的成分说明和洗涤指导,特别是洗涤指导,不要过于简单;对于功能性服装如羽绒服、塑体内衣、保暖服等要有细致的使用说明,不要简单地使用几个标准的洗涤图标反映。细致的说明可以体现公司对客户的负责和体贴的态度;对于复杂的说明指导,可以使用图例形式、甚至可以使用卡通来制作,这样生动而创新;可以适当地使用图片,如名模靓女身着产品的照片,给人以直观的感受,使消费者对品牌产品有更深刻的印象,起到了很好的宣传促销作用;条形码(Barcode)成为现代物流的标志,超级市场和大型商场都要求商品标注条形码,因此不要忘记打上条形码。关于条形码的使用和商品分类,一定要科学合理,不能随便编码;有关认证标志,例如反映产品质量保证的IS09001/9002、环保IS014000、全棉标志、纯羊毛标志、欧洲绿色标签Oeko—TexStandardl00、欧洲生态标签E-co—1abel等,要积极悬挂,利于反映产品的质量特点,体现企业形象,赢得客户的信赖和认知;配合全息防伪和条码防伪。随着服装市场的日益繁荣,竞争也势必更加激烈,对于品牌和名牌厂商,为了保护自己的产品不受假冒伪劣产品的侵害,可以使用各种防伪技术,这既保护企业自身的利益,也维护了广大消费者的权益;印上鸣谢、祝愿的话语,给人以亲切感。最好配上简约又优雅的诗歌,打动消费者的心;针对季节、消费对象、产品特点,将吊牌设计成年历、书签、贺卡等令消费者喜爱、珍视、欣赏的收藏物,成为持久的广告。

  家具铜饰件。吊牌是有屈曲串联构成的活动拉手,旋转自如,使用方便,由于民间匠师的精心设计,形式丰富多样,是更具特色的铜饰件之一。


风貌,理念,吊牌

Application Area


The company's core team has been engaged in plasma cleaning and surface treatment research for more than ten years. The products have been widely used in integrated circuit IC packaging, LED packaging, LCD chip, component packaging, thick film circuit packaging, engineering plastic surface treatment and other processes. The in-line plasma cleaning machine produced by our company has significantly improved product reliability and yield compared with the traditional method. 

01

MATERIAL CLEANING

Plasma technology can provide solutions for all types of pollutants, all substrates, and all subsequent treatments. In addition, it can also decompose residual pollutants composed of molecules.

02

MATERIAL ACTIVATION

The surface of the material after plasma treatment has good wettability, which is a prerequisite for ensuring good adhesion with the bonding body during painting, bonding, printing, or bonding.

03

MATERIAL ETCHING

Plasma technology can be used for both anisotropic and isotropic etching. Isotropic etching is performed through chemical etching, and anisotropic etching is performed through physical etching.

04

MATERIAL COATING

Using low-pressure plasma can improve workpieces with different coatings. For this purpose, gaseous and liquid raw materials are transported to a vacuum chamber, and the raw materials in the plasma, most of the short chain monomers, combine with each other to form long chain polymers, which are then coated on the surface of the substrate to form a uniform and reliable coating.

COMMON CLEANING STATIONS

Before wiring integrated circuit IC packaging

Before surface coating of optical components

Before PCB board copper deposition and component installation

Cleaning of the carrier before chip bonding

Before printing on the surface of rubber materials

Plasma debonding

Before wiring and packaging the shell

Before printing on the glass surface

Before IGBT wire bonding

Before wiring and bonding LED packaging

Before coating the surface of engineering plastics

Surface treatment of biological and medical devices

COMMON CLEANING PROCESS POSITION IN PACKAGE & TESTING FIELD

EFFICACY

01

Remove surface pollutants

02

Increase surface hydrophilicity

03

Enhance the adhesion force on the substrate surface

04

Increase the pushing and pulling force

05

Reduce the defect rate of virtual soldering

06

Reduce layering