With the rapid development of high-end integrated circuit chips, its pin density is getting higher and higher, and the electrostatic sensitivity generated in the cleaning process is becoming more and more stringent and the requirements for cleaning cleanliness are also rising, the traditional wet cleaning or 4.21MHz radio frequency plasma cleaning can not meet its cleaning requirements to a certain extent, the microwave plasma cleaning process is applied and born, it is likely to become the next generation of mainstream precision cleaning process, compared with radio frequency plasma cleaning, it has the following advantages:

• The ion concentration is high, and the reaction speed is faster and more uniform
• The self-bias voltage is low, and there is no electrostatic damage to the cleaning device
• Cleaning is gentler and there is no sputtering contamination of the cleaning products

Welcome new and old customers to inquire, consultation telephone 0510-83595266 18551045188