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AW-QP series single plasma degluing machine

Application of Equipment
High-performance single-chip glue (glue), mainly used in 4, 6, 8 inch diameter semiconductor single-chip glue, plasma surface cleaning, sweep the bottom film process.
The main application fields include: chip manufacturing, MEMS, solar cells, compound industry (GaAs, GaN, GaP, InP, SiC, etc.), photoelectric industry, etc. The main application processes include: glue removal, controllable photoresist removal (bottom film before etching), GaAs, InP wafer glue removal and bottom scanning

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Keywords: filter, filter element, hydraulic accessories

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Product Parameters

Product Model	AW-QP600
Overall dimensions (excluding alarm lighthouse)	1200(L)× 1500(W)× 1750(H)mm pump external
Reaction chamber material	Quartz 6061 aluminum alloy
Plasma generator	Frequency 13.56MHz, power 0-600W adjustable, automatic impedance matching
Deglued disc size	4 inch, 6 inch, 8 inch
Degumming rate	300-1500A/min
Temperature control	30~160 ℃, ± 3 ℃
Capacity and Fragmentation Rate	Single chamber 45~60 tablets/hour, ≤ 1/1000
Vacuum system	Oil pump/dry pump optional, imported pneumatic angle valve, inflation valve, high precision vacuum gauge
Gas path system	MFC mass flow meter control (standard configuration 2 channels):5 SLMO₂ and 1SLM N
Control System	Touch type industrial computer PLC control
Remarks	Flexible design/multi-cavity design according to customer demand